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LS-DYNA&JSTAMP Forum 2013


Outline of LS-DYNA&JSTAMP Forum 2013

Organizer: JSOL Corporation
Dates: Wednesday, July 24 - Friday, July 26, 2013
Venue: Tokyo Conference Center Shinagawa (Tokyo, Japan)
URL: http://www.tokyo-cc.co.jp/eng/access.html
Expected number of participants: Approximately 400


Wednesday, July 24 : Program
Thursday, July 25 : Technical Session
Friday, July 26 : Training Seminars



Program

Wednesday, July 24

9:00- Registration
9:30 - 9:40 Opening
General Session(1)
9:40 - 10:25 KI-01  <Keynote Speech>
Towards Including Virtual Testing Procedure into the Homologation Process - Experiences within the EU-Project IMVITER
Dr. Thomas Münz, DYNAmore GmbH
Automotive Session Integrated solutions Session Manufacuturing Session(1)
10:35 - 11:05 MO-01
Numerical Simulation of Vehicle's Rollover Behavior by using LS-DYNA
Mr. Tatsuya Fukushima, NISSAN Motor Co., Ltd.
SO-01
Digimat-CAE/LS-DYNA application for full vehicle crush
Mr. Noriyo Ichinose, JSOL Corporation
P1-01
TBA
Mr. Sou Suzuki, G-TEKT CORPORATION
11:10 - 11:40 MO-02
Side Airbag deployment through a seat tear seam rupture in LS-DYNA
Mr. Kazuo Imura, HONDA R&D Co., Ltd.
SO-02
Product development & Human resource development with CAE in LION Corporation
Mr. Nobuhito Nakagawa, LION Corporation
P1-02
Stamping simulation techniques for high strength steel sheets
Dr. Tohru Yoshida, Nippon Steel & Sumitomo Metal Corporation
11:45 - 12:15 MO-03
Implementing advanced FE modeling in the newly updated Hybrid-III crash test dummy
Dr. Intaek Lee, Humanetics Innovative Solutions Japan
SO-03
Comparison of internal fixations for distal clavicular fractures based on loading tests and finite element analyses
Ms. Rina Sakai, Kitasato University
P1-03
Technology of formability prediction in hot stamping simulation
- Effect of deformation property and friction property in high temperature and for hot stamping formability -

Mr. Masahiro Nakata, Nippon Steel & Sumitomo Metal Corporation
12:15 - 13:30 Lunch
New technologies Session Material Session Manufacuturing Session(2)
13:30 - 14:00 NT-01
Simulation and Innovation
Dr. Masataka Koishi, The Yokohama Rubber Co.,Ltd.
MA-01
Material Testing, Modeling and Validation Techniques for MAT_SAMP-1
Dr. Kunio Takekoshi, TERRABYTE Co., Ltd.
P2-01
Efforts to mold cooling analysis in hot stamping
Mr. Kentaro Nakamura, Y-tec corporation
14:05 - 14:35 NT-02
DIFFCRASH analysis of airbag scatter in crash simulation
Dipl.-Math. Clemens-August Thole, SIDACT GmbH
MA-02
Evaluation of mechanical properties of weldline by cooperation with Moldex3D and DIGIMAT
Mr. Takato Nakayama, JSOL Corporation
P2-02
TBA
Mr. Takeshi Fujisawa, SYVEC CORPORATION
14:40 - 15:10 NT-03
A Statistical Analysis of Arm Kinematics Effect on Occupant Dummy Chest Deceleration on Passenger Side in Frontal Impacts
Mr. Tatsuya Komamura, TOYOTA MOTOR CORPORATION
MA-03
Experimental measurement and FE analysis of damage effects for rubber materials
Ms. Ai Kawasaki, Mechanical Design & Analysis Corporation
P2-03
Application of optical metrology for FEA
Mr. Yusuke Kawasaki, Marubeni Information Systems Co., Ltd.
15:10 - 15:20 Break
General Session(2)
15:20 - 16:20 KI-02<Keynote Speech>
TBA
Dr. Nobuo Fukuwa, Nagoya University
16:20 - 17:05 JS-01
CAE, The State-of-Arts and the Future - LS-DYNA / JSTAMP for the next step
Mr. Takahiko Miyachi, JSOL Corporation
17:05 - 18:05 JS-02
Recent Development in LS-DYNA
Dr. John O. Hallquist, Livermore Software Technology Corporation
18:10 -  Gala Dinner



Technical Session

Thursday, July 25

Technical Session is tecnical lecture from JSOL to get advanced knowledge of LS-DYNA, JSTAMP.
This is only for JSOL's product customers.
There are no operation work shop of software, just technical lecture is provided.

poster session
8:00 - 10:00 poster session

Technical Session(1) Technical Session(2) Product
10:00-10:45 T1-01
The roadmap of automotive safety regulations and development plans of FE dummy and barrier models
Mr. Masahiro Okamura, JSOL Corporation
T2-01
JSTAMP/NV Tips
Mr. Yuji Kato, JSOL Corporation
PR-01
Introduction of Simpleware
Ms. Miki Miyazaki, JSOL Corporation
11:00-11:45 T1-02
LS-DYNA Plastic Material model
Mr. Toru Shimizu, JSOL Corporation
T2-02
JSTAMP/NV Application and materia
Mr. Hiroshi Fukiharu, JSOL Corporation
PR-02
CAE workspace Comet
Mr. Takanori Katsuta, JSOL Corporation
11:45-13:00 Lunch
13:00-13:45 T1-03
Fatigue with LS-DYNA
Mr. Hidenori Nomura, JSOL Corporation
T2-03
Primer: 20 New and Useful Techniques for Fast and Efficient Working
Mr. Richard Taylor, Arup
PR-03
AFDEX
Mr. Makoto Yanagisawa, JSOL Corporation
14:00-14:45 T1-04
Selection of explicit or implicit analysis
Mr. Masakazu Yanagisawa, JSOL Corporation
T2-04
JFOLD - Introducing A New Simulation-Based Airbag Folding System for LS-DYNA
Mr. Shinya Hayashi, JSOL Corporation
PR-04
Welding Simulation
Mr. Masao Nakada, JSOL Corporation
15:00-15:45 T1-05
Advanced use of the element in LS-DYNA
Mr. Norio Shimizu, JSOL Corporation
T2-05
Incompressible CFD module Presentation
Mr. Inaki Caldichoury, Livermore Software Technology Corporation
PR-05
Efficient way of JVISION
Mr. Shinya Hiroi, JSOL Corporation
16:00-16:45 T1-06
LS-DYNA Fracture modeling
Mr. Kei Saito, JSOL Corporation
T2-06
New Featues of LS-PrePost
Mr. Philip Ho, Livermore Software Technology Corporation
PR-06
Moldex3D
Mr. Toshiaki Hayashi, JSOL Corporation
17:00-17:45 T1-07
Proposal of the efficient speed-up technique in LS-DYNA
Mr. Tetsuji Ida, JSOL Corporation
T2-07
Overview of frequency domain analysis in LS-DYNA
Mr. Yun Huang, Livermore Software Technology Corporation
PR-07
digimat
Mr. Toshiya Kano, JSOL Corporation


Training Seminars

Friday, July 26

Training Seminars
10:00-17:00 TS-1
Incompressible CFD solver (ICFD) and FSI in LS-DYNA : Introduction and application
Mr. Inaki Caldichoury, Livermore Software Technology Corporation
TS-2
Frequency Domain Vibration, Acoustic and Durability Analysis with LS-DYNA
Mr. Yun Huang, Livermore Software Technology Corporation
TS-3
Introduction to LS-PrePost
Mr. Philip Ho, Livermore Software Technology Corporation



Contact

Harumi Center Bldg.,2-5-24, Harumi, Chuo-ku, Tokyo 104-0053, Japan
JSOL Corporation, Engineering Technology Division
E-mail : event@sci.jsol.co.jp